Lascar benefits from electronics manufacturing facilities in both the UK and the Far East. We are able to offer small batch or high volume production as well as full test, QA and supply chain solutions. Whether your project requires our design input or is already in production, we can help.

Lascar's facilities in Hong Kong provide customers with the many benefits of Far-Eastern manufacturing. We work with a select number of long term manufacturing partners in Shenzhen, China providing our customers with a risk free route to Far-Eastern manufacture and the associated cost savings this brings.

Surface Mount & Conventional Electronic Assembly

Placement of components down to 01005 and uBGAs on a variety of substrates including FR4, T-clad, steel and ceramic.

Chip-On-Board Wire Bonding

Aluminium and gold bare die wire bonding machines for chip-on-board assembly including epoxy encapsulation.


Plastic Injection Mould Tooling

Aluminium or chromium steel injection mould tooling for plastics and rubber components.

Thick Film Hybrids

Electronic circuits printed onto ceramic tiles for use in extreme temperature applications or applications where high reliability is required.

Laser Trimming

High speed functional in-circuit laser trimming for applications requiring extremely high accuracy resistor values.

Product Assembly

Final assembly of all electronic and mechanical parts including loading firmware, monitored through inspection gateways.


The foundation of our business is built around a philosophy of exceptional levels of quality. This is ingrained in both our company culture and processes. All processes are carried out in accordance with ISO 9001 standards to achieve world-class quality levels. As part of our ongoing quality improvement policy, all assemblies are passed through an Automated Optical Inspection (AOI) process and are inspected to IPC-A-610 Class 3. Custom test fixtures can be designed to meet any specific product qualification requirements, including electronic serialisation and full result traceability.